Kun Chenl

Publication Activity (10 Years)

Years Active: 2019-2019
Publications (10 Years): 1

Top Topics

Solder Ball Connect

Thermal Imaging

Top Venues

Publications

Kun Chenl, Zimin Jin, Jing Jin, Jianwei Tao
Research on the Thermal-Wet Comfort Performance for the Knitting Sports Shoes. ISCID (1) (2019)