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Kun Chenl
Publication Activity (10 Years)
Years Active: 2019-2019
Publications (10 Years): 1
Top Topics
Solder Ball Connect
Thermal Imaging
Website
Top Venues
ISCID (1)
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Publications
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Kun Chenl
,
Zimin Jin
,
Jing Jin
,
Jianwei Tao
Research on the Thermal-Wet Comfort Performance for the Knitting Sports Shoes.
ISCID (1)
(2019)