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Kazuo Kondo
Publication Activity (10 Years)
Years Active: 2011-2019
Publications (10 Years): 2
Top Topics
Thin Film
Artificial Intelligence
Complexity Reduction
Wireless Sensor Networks
Top Venues
3DIC
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Publications
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Quy Dinh
,
Kazuo Kondo
,
Tetsuji Hirato
Reduction of TSV Pumping.
3DIC
(2019)
Kazuo Kondo
,
Shingo Mukahara
,
Masayuki Yokoi
,
Jin Onuki
No pumping at 450°C with electrodeposited copper TSV.
3DIC
(2015)
Taro Hayashi
,
Kazuo Kondo
,
Minoru Takeuchi
,
Yushi Suzuki
,
Takeyasu Saito
,
Naoki Okamoto
,
Masao Marunaka
,
Takayuki Tsuchiya
,
Masaru Bunya
3D interconnected technology by high speed copper electrodeposition using diallylamine levelers.
3DIC
(2011)